What is the QFN die pad?

What is the QFN die pad?

The QFN package is designed so that the lead frame die pad (or thermal pad) is exposed on the bottom of the IC (see Figure 1). This provides an extremely low thermal resistance (θJC) path between the die and the exterior of the package.

What is the QFN IC package?

The QFN package is a thermally enhanced standard size IC package designed to eliminate the use of bulky heat sinks and slugs. This package can be easily mounted using standard PCB assembly techniques and can be removed and replaced using standard repair procedures.

What is a QFN PCB?

This document helps printed-circuitboard (PCB) designers understand and better use this information for optimal designs. The QFN package is a thermally enhanced standard size IC package designed to eliminate the use of bulky heat sinks and slugs.

What type of solder paste should I use to mount a QFN?

Thermal Pad Stencil Opening TI recommends the use of type 3 or finer solder paste when mounting a QFN. For detailed information on the QFN package including thermal modeling considerations and repair procedures, see (SLUA271) QFN/SON PCB attachment.

What is the design of the QFN?

The dual-row or multi-row QFN package utilizes an interstitial lead design that results in a staggered lead arrangement. The inner row is offset 0.5 mm, which results in a compact design that maximizes die size while not exceeding the surf ace mount technology (SMT) capability of a typical 0.5 mm pitch SMT process.

What is a multi-row QFN?

The dual-row or multi-row QFN package utilizes an interstitial lead design that results in a staggered lead. arrangement. The inner row is offset 0.5 mm, which results in a compact design that maximizes die size. while not exceeding the surf ace mount technology (SMT) capability of a typical 0.5 mm pitch SMT process.